Ranovus demonstrates co-packaged optics | VentureBeat

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Though there may be nonetheless a number of innovation in conventional copper-based interconnects, together with the lately introduced UCIe chiplet commonplace, in the previous few years the business has additionally more and more began to as a substitute use mild (or optics), particularly within the datacenter. Some even argue that copper is near reaching a reminiscence wall. 

In that regard, silicon photonics has confirmed to be superior relating to value, energy consumption and bandwidth as an inter-package to long-range interconnect. At Optical Fiber Conference2022, a number of bulletins have been made as the subsequent step in direction of making silicon photonics really ubiquitous.

Ranovus demonstrates 800G interconnect for co-packaged optics

Ranovus has introduced and demonstrated a co-packaged optics platform, known as Analog-Drive CPO 2.0, based mostly on its Odin 800 Gbps structure. The product is a collaboration with TE Connectivity, which was answerable for the nice pitch socket interposer expertise.

Because the introduction of silicon photonics within the knowledge middle about half a decade in the past, optics-based interconnects are slowly turning into extra ubiquitous within the knowledge middle, as integration and quantity manufacturing have lowered its value in comparison with discrete optics and copper. The following evolution is to combine the transceivers even nearer to the switches, which may additional scale back energy. That is known as co-packaged optics (CPO). Silicon photonics engines may be built-in with different silicon similar to AI accelerators to scale back the facility and price of knowledge transmission.

The CPO resolution that Ranovus demonstrated is predicated on its Odin silicon photonics engine, which delivers 100 Gbps per wavelength and consists of electro-photonic built-in circuit cores, a laser platform and superior packaging. The engine scales from 800Gbps to three.2Tbps, though the demonstration was at 800Gbps. The co-packaged facet is achieved by TE’s interposer expertise, which permits for integration of the photonics engines with an ASIC. Ranovus mentioned the expertise is being trialed all through the business. 

It must be famous, although, that Ranovus isn’t the one firm engaged on co-packaged optics. For instance, in 2020, Intel introduced an identical demonstration of co-packaged optics together with its Barefoot Community Tofino ethernet change. Intel goals to commercialize the expertise by the top of 2023 beginning at 50Tbps switches, which is twice as a lot bandwidth as the present cutting-edge. 

Ranovus demonstrates co-packaged optics mixed with Xilinx Versal 

In an identical spirit because the earlier demonstration, Ranovus additionally demonstrated its 800G CPO 2.0 platform along with a Xilinx Versal FPGA, aimed toward AI/ML workloads. Ranovus mentioned this lowered energy in addition to value by simplifying board routing. Ranovus instructed EETimes it anticipated the fee to be about one-tenth of an everyday $800 400G module and that the facility consumption was lowered by at the least 10W, consuming simply 4W. 

“We’ve been on the forefront 2 of the CPO motion since 2018 and are delighted to share our multidisciplinary IP cores with our clients who need to speed up the adoption of Analog Drive CPO in knowledge facilities,” mentioned Hamid Arabzadeh, chairman and CEO of Ranovus. 

“We’re pleased with our collaboration with Ranovus that helped obtain report efficiency ranges whereas on the similar time decreasing energy and general footprint of the whole resolution,” mentioned Dan Mansur, vp of the adaptable and embedded computing group at AMD (previously Xilinx). “This CPO demonstration highlights the flexibility of the Versal GTM SERDES to function over something from long-reach copper to straight driving the Ranovus Analog-Drive CPO 2.0 optical engine. Co-packaging Ranovus Odin™ with Xilinx Versal is a big development, which permits knowledge middle clients to construct extremely environment friendly and cost-effective programs for next-generation workloads.”

Ranovus delivers 100G optical I/O cores based mostly on GlobalFoundries’ Fotonix platform

Lastly, Ranovus introduced the supply of its protocol-agnostic Odin 100G optical I/O core, which was used within the two demonstrations described above. It’s based mostly on GlobalFoundries’ Fotonix silicon photonics platform that mixes photonics and RF-CMOS on a 300mm silicon wafer.

Because the identify implies, the Odin 100G core delivers 100Gbps bandwidth per wavelength. Ranovus additional says that it’s scalable from 8 to 32 cores in a package deal, which suggests it might ship as much as 3.2Tbps in complete. The core is obtainable as optical I/O chiplets or IP core, and as such could be built-in with processors, switches and reminiscence home equipment. This permits the expertise to deal with a wide range of segments together with AI/ML, metaverse, cloud, 5G communications, protection and aerospace. 

GF Fotonix

GlobalFoundries itself introduced its Fotonix platform at Optical Fiber Convention 2022 together with a number of buyer wins similar to Broadcom, Cisco and Nvidia. Collectively, its clients embody almost all main contenders in (silicon) photonics, except for Intel. GlobalFoundries mentioned the platform scales as much as 500Gbps per fiber. The primary PDK shall be obtainable in April. 

“Silicon photonics is now acknowledged as a obligatory expertise for the datacenter revolution, and our main semiconductor manufacturing expertise platform accelerates adoption into the mainstream,” mentioned Amir Faintuch, senior vp and basic supervisor of compute and wired infrastructure at GlobalFoundries.

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